FORFARANDE FOR FORBETTRING AV ELEKTRISKA KRETSKORTS LODBARHET

1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non io...

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Bibliographic Details
Main Authors H HADERSBECK, E ANDRASCEK
Format Patent
LanguageSwedish
Published 19.05.1980
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SWITCHES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
RELAYS
SELECTORS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non ionic surfactant and an organic acid and then activating in an aqueous solution containing potassium peroxy disulphate (persulphate) and an acid. The preferred cleaning solution contains 20-100g/l of an hydroxyethylated alkyl phenol and 15-80g/l of an organic acid such as formic acid. The activating solution is preferably saturated with the potassium peroxydisulphate the pH adjusted to 2-4 with H 2 SO 4 and stabilized with phosphoric acid. The boards may be rinsed with water between treatments and also retreated in the cleaning solution after treating in the activating solution. Colophony or soldering lacquers may then be applied and dried.
Bibliography:Application Number: SE19760007677