RADIO-ELECTRONIC BLOCK

• Main Authors: ARKHIPOV VLADIMIR ALEKSEEVICH, JAKOVLEV JURIJ EVGEN'EVICH, SMIRNOV PETR VASIL'EVICH, KUZIN GENNADIJ KONSTANTINOVICH, OLAEV VITALIJ ALEKSEEVICH
• Format: Patent
• Language: English; Russian
• Published: 27.08.2007
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

FIELD: radio-electronics, possible use in radio-electronic equipment blocks for solving the problem of draining heat from heat-loaded radio-electronic components positioned on electronic board and having planar clamps, and for protecting a screened circuit. ^ SUBSTANCE: radio-electronic block contains a heat-conductive body, electronic board with heat-loaded radio-electronic component with planar clamps mounted on it, body of which is equipped with heat-draining base, connected to heat-conductive body with ensured thermal contact between them. Planar outputs of radio-electronic component are bent in Z-like manner towards the heat-conductive base of its body and soldered together on the side of installation of radio-electronic component on contact areas of the board. Heat-conductive body is made with electro-conductive cover, where at least one side is made in form of one or several elements, bent inwardly to the body, of cup-like multilevel shape and (or) multi-stepped U-shaped profile, where the length of profile, in its turn, creates at least one multi-stepped U-shaped profile, where first level is positioned in through windows of electronic board before the contact with heat-draining base of the radio-electronic component body, second level - before the heat-exchanging contact area with ensured thermal contact and thermal conductivity from planar clamps, third level is positioned before electric contact with board grounding contour, and following three analogical levels are positioned in through windows of the first board before heat-draining base of radio-electronic component on the second board, and analogically driven through windows of each level-wise positioned n number board. ^ EFFECT: increased efficiency and increased reliability of cooling, protection from electromagnetic interference, simplified assembly with its possible automation and possible disassembly of the heat-loaded radio-electronic component. ^ 6 dwg