METHOD FOR FILLING POCKETS WITH MATERIAL

FIELD: micro- and nanoelectronics, micro- and nanomechanics where insulated conductors are used. ^ SUBSTANCE: proposed method for filling pockets in solid body with conducting material includes coating of solid-body surface, bottom, and side walls of mentioned pockets with first layer that functions...

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Bibliographic Details
Main Authors MOCHALOV A.I, KLIMOVITSKIJ A.G, GROMOV D.G, SULIMIN A.D
Format Patent
LanguageEnglish
Russian
Published 10.08.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:FIELD: micro- and nanoelectronics, micro- and nanomechanics where insulated conductors are used. ^ SUBSTANCE: proposed method for filling pockets in solid body with conducting material includes coating of solid-body surface, bottom, and side walls of mentioned pockets with first layer that functions as barrier material preventing diffusion of mentioned conducting material in solid body; application of second layer onto first one that functions as wetting layer for conducting material; application of third layer by way of physical or chemical deposition onto third one from gas phase that has in its composition mentioned conducting material; coating of third layer with fourth one that also incorporates conducting material; melting of conducting material by heating and profile leveling; material melting by heating is conducted after applying third layer and fourth layer is applied by any method of physical deposition from gas phase, chemical deposition from gas phase, chemical deposition from solution, electrochemical deposition, or chemical-mechanical deposition. ^ EFFECT: facilitated procedure, enlarged functional capabilities. ^ 12 cl, 17 dwg
Bibliography:Application Number: RU20040107258