HEAT-RESISTANT ADHESIVE COMPOSITION

FIELD: heat- resistant adhesive compositions possessing high strength of bonded joints at temperature of 400 C working at such temperature for 50 h; space engineering. SUBSTANCE: proposed composition includes phenolformaldehyde resin, carboxylated butadiene acrylonitrile rubber, 1.7- di(oximethyl)-m...

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Bibliographic Details
Main Authors KOTOVA E.V, KABLOV E.N, LUKINA N.F, MINAKOV V.T, PETROVA A.P
Format Patent
LanguageEnglish
Russian
Published 10.05.2003
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:FIELD: heat- resistant adhesive compositions possessing high strength of bonded joints at temperature of 400 C working at such temperature for 50 h; space engineering. SUBSTANCE: proposed composition includes phenolformaldehyde resin, carboxylated butadiene acrylonitrile rubber, 1.7- di(oximethyl)-m-carborane, organic solvent, oligo-methyl phenyl carborane siloxane. Used as phenol-formaldehyde resin is mixture of novolak and resol phenol- formaldehyde resins at the following relationship of components, parts by mass: (15.0-35.0) : (15.0-35.0). Composition may additionally contain filler in the amount of 100.0 to 200.0 parts by mass. EFFECT: increased service life of bonded joints; enhanced reliability of joints working at 400 C for 50 h. 5 cl, 2 tbl
Bibliography:Application Number: RU20010125969