USE OF A SURFACE FOR HEAT TRANSFER, MORE ESPECIALLY FOR FLUID EVAPORATION AND CONDENSATION PROCESS

The heat transfer surface (3), on a plate or tube body (4), has a galvanized projecting micro-structure extending from the base surface (3a) with a minimum height of 10 mu m. The base surface is covered with projections (6), wholly or partially, as pin-shaped micro-structures. The longitudinal axes...

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Bibliographic Details
Main Authors HELMUT PIETSCH, JOVAN MITROVIC, DR, ANDREAS SCHULZ, DIETER GOLLAN
Format Patent
LanguageEnglish
Portuguese
Published 22.04.2008
Subjects
APPARATUS THEREFOR
BLASTING
CHEMISTRY
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
WEAPONS
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Summary:The heat transfer surface (3), on a plate or tube body (4), has a galvanized projecting micro-structure extending from the base surface (3a) with a minimum height of 10 mu m. The base surface is covered with projections (6), wholly or partially, as pin-shaped micro-structures. The longitudinal axes (6c) of the micro-pins are either at right angles to the surface or they are pitched at an angle of 30-90 degrees to the surface. The micro-pins have a thickness (d) of 0.2-100.0 mu m, with a pin density of 10 -10 per cm . The structures are galvanized on to the surface using a polymer membrane with micro-pores.
Bibliography:Application Number: PT20020027031T