RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME

• Main Authors: KURIHARA, RYUTA, ISHIGURO, ATSUSHI, CHIBA, DAIDO, KOIDE, YOUHEI
• Format: Patent
• Language: English; Polish
• Published: 30.11.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention is a resin composition comprising an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition comprising the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that comprises at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] comprising a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] comprising a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35. The invention is also a formed article obtained by forming the resin composition. The invention provides a resin composition particularly suitable for: a solar cell element sealing material having low hygroscopicity, non-hydrolyzability, weather resistance, transparency, and improved flexibility to prevent cracking of the cell during vacuum lamination; and an adhesive for laminated glass having transparency, light resistance, the ability to prevent scattering of cracked glass at low temperature, and excellent adhesiveness at low temperature.