CHIP CARD AND MANUFACTURING METHOD

The card has a body (15) and an electronic module (1) that is placed within a recess (17) of the body. A colored layer (13) is placed between the electronic module and the bottom of the recess of the card body. The colored layer is provided identical to a color of the card body. The electronic modul...

Full description

Saved in:
Bibliographic Details
Main Authors LAVIRON THIERRY, GUIJARRO SÉBASTIEN, DOSSETTO LUCILE
Format Patent
LanguageEnglish
Polish
Published 31.07.2017
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The card has a body (15) and an electronic module (1) that is placed within a recess (17) of the body. A colored layer (13) is placed between the electronic module and the bottom of the recess of the card body. The colored layer is provided identical to a color of the card body. The electronic module comprises a protection resin (8) and the colored layer is carried by the protection resin. The colored layer is carried by the bottom of the recess of the card body. The colored layer is carried out by ink impression. An independent claim is also included for a method for manufacturing a smart card.
Bibliography:Application Number: PL20130711052T