Light emitting diode module

A method for manufacturing a electronic and/or optoelectronic module comprises the following steps: - mounting a electronic and/or optoelectronic chip on a board, - making on the board an outer ring made from a liquid resin, the outer ring surrounding the electronic and/or optoelectronic chip, - mak...

Full description

Saved in:
Bibliographic Details
Main Authors SCHRANK, FRANZ, HOSCHOPF, HANS
Format Patent
LanguageEnglish
Polish
Published 30.11.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method for manufacturing a electronic and/or optoelectronic module comprises the following steps: - mounting a electronic and/or optoelectronic chip on a board, - making on the board an outer ring made from a liquid resin, the outer ring surrounding the electronic and/or optoelectronic chip, - making a central filling of the volume defined by the outer ring, the central filling being made from a liquid resin and covering the top surface of the electronic and/or optoelectronic chip, - curing in one single step the resin of the outer ring and the central filling and making a chemically linked interface between the outer ring and the central filling.
Bibliography:Application Number: PL20120198155T