PHOTOVOLTAIC MODULES WITH POLYPROPYLENE BASED BACKSHEET
The present invention describes a backsheet (10) for electronic devices comprising at least a heat resistant layer (12c) reactive and attached with a PolyOlefine based tie-layer(s) (12b) provided at the side facing the active material (4) to be encapsulated. Optionally further layer(s) (12a) are pro...
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Main Author | |
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Format | Patent |
Language | English Polish |
Published |
29.05.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention describes a backsheet (10) for electronic devices comprising at least a heat resistant layer (12c) reactive and attached with a PolyOlefine based tie-layer(s) (12b) provided at the side facing the active material (4) to be encapsulated. Optionally further layer(s) (12a) are provided on top of layer (12b), being Flexible PolyPropylene and/or (co-)PE based layer(s). Optionally a last layer (13b) is provided facing the active material (4) based on (co-)PE based tie-layer (13b), such layer providing good adhesion directly on the back-side of the active material (4), or attached barrier layers. |
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Bibliography: | Application Number: PL20100732882T |