PHOTOVOLTAIC MODULES WITH POLYPROPYLENE BASED BACKSHEET

The present invention describes a backsheet (10) for electronic devices comprising at least a heat resistant layer (12c) reactive and attached with a PolyOlefine based tie-layer(s) (12b) provided at the side facing the active material (4) to be encapsulated. Optionally further layer(s) (12a) are pro...

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Bibliographic Details
Main Author RUMMENS, FRANCOIS
Format Patent
LanguageEnglish
Polish
Published 29.05.2015
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Summary:The present invention describes a backsheet (10) for electronic devices comprising at least a heat resistant layer (12c) reactive and attached with a PolyOlefine based tie-layer(s) (12b) provided at the side facing the active material (4) to be encapsulated. Optionally further layer(s) (12a) are provided on top of layer (12b), being Flexible PolyPropylene and/or (co-)PE based layer(s). Optionally a last layer (13b) is provided facing the active material (4) based on (co-)PE based tie-layer (13b), such layer providing good adhesion directly on the back-side of the active material (4), or attached barrier layers.
Bibliography:Application Number: PL20100732882T