NOZZLE ARRANGEMENT

• Main Authors: KUNZE HENRY, WIENER FERDINAND, KOPP LORENZ
• Format: Patent
• Language: English; Polish
• Published: 31.08.2010
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NOZZLES; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.