PROTECTIVE FILM-FORMING FILM AND PROTECTIVE FILM-FORMING COMPOSITE SHEET

[Problem] To provide a protective film-forming film that minimizes warping of a wafer, and is capable of forming a highly-reliable protective film on a chip. [Solution] This protective film-forming film is thermally curable, has a glass transition temperature after being thermally cured of 150 to 30...

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Bibliographic Details
Main Authors YAMAMOTO, DAISUKE, TAKANO, KEN, SAIKI, NAOYA
Format Patent
LanguageEnglish
Published 01.02.2016
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:[Problem] To provide a protective film-forming film that minimizes warping of a wafer, and is capable of forming a highly-reliable protective film on a chip. [Solution] This protective film-forming film is thermally curable, has a glass transition temperature after being thermally cured of 150 to 300oC, and has a modulus of elasticity at a temperature of 23oC after being thermally cured of 0.5 to 10 GPa.
Bibliography:Application Number: PH20151502208