IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point....

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Main Authors PENG WEI, XINFENG WANG, MING ZHANG, HAO ZHOU, JIN YANG, ERIC D. MCAFEE, YINGLEI REN, JE-YOUNG CHANG, YUAN-LIANG LI, GUOLIANG YING, PAUL J. GWIN, RA'ANAN SOVER, CONG ZHOU, YUEHONG FAN, DAVID SHIA, LIGUANG DU, JIMMY CHUANG, QING JIANG, LIANCHANG DU, SANDEEP AHUJA, LIU YU, XICAI JING, TIMOTHY GLEN HANNA
Format Patent
LanguageEnglish
Published 30.06.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.
Bibliography:Application Number: NL20222033589