OPTICAL INTEGRATED CIRCUIT WITH ENCAPSULATED EDGE COUPLER

Optical integrated circuit (300) for edge coupling and method of producing thereof. The optical integrated circuit comprises a substrate (10); a top layer (20) arranged on the substrate comprising 5 a waveguide (25); and an edge-coupler (30) arranged on the substrate (10), the edge-coupler (30) comp...

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Bibliographic Details
Main Authors BRADLEY WILLIAM SNYDER, ADRIANO RICARDO DO NASCIMENTO JÚNIOR
Format Patent
LanguageEnglish
Published 21.12.2023
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Summary:Optical integrated circuit (300) for edge coupling and method of producing thereof. The optical integrated circuit comprises a substrate (10); a top layer (20) arranged on the substrate comprising 5 a waveguide (25); and an edge-coupler (30) arranged on the substrate (10), the edge-coupler (30) comprising an optical membrane (31) extending above a cavity (32) in the substrate (10) and the edge-coupler (30) being configured for optically coupling the waveguide (25) to an external optical element (1); a mechanical support (40) fixedly attached at an end thereof to the substrate (10), either directly or indirectly via the top layer (20), and attached at an opposing end thereof to the 10 optical membrane (31); wherein the edge coupler (30), the substrate (10), and the mechanical support (40) jointly form a flat surface (50) configured for edge coupling to the external optical element(1) Figure 9
Bibliography:Application Number: NL20222032178