Quantum computing apparatus with interposer, method of fabrication thereof, method of performing a quantum computing operation, quantum computing apparatus comprising tantalum nitride and a method of fabrication thereof
The present invention discloses a quantum computing apparatus, comprising a substrate layer, a patterned layer adjacent and parallel to the substrate layer such that the substrate layer and the patterned layer form a layer stack. The patterned layer comprises an electrical conductive material and fo...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
18.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention discloses a quantum computing apparatus, comprising a substrate layer, a patterned layer adjacent and parallel to the substrate layer such that the substrate layer and the patterned layer form a layer stack. The patterned layer comprises an electrical conductive material and forms at least part of one quantum computing circuit component. The quantum computing apparatus further comprises an interposer comprising a substantially rigid connection element mechanically connected to the layer stack and positioned in a non- parallel plane, preferably being substantially orthogonal, to the plane in which the substrate layer is formed. A conductive element is formed on or in the connection element, preferably a transmission line, for providing an electrical connection to the patterned layer. |
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Bibliography: | Application Number: NL20222030907 |