PLATING BATH AND METHOD FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to en-hance bath stability.

Saved in:
Bibliographic Details
Main Authors Shakeel AKHTAR, Dr. Holger BERA, Dr. Jan PICALEK, Jennifer PINNAU, Dr. Iulia BEJAN
Format Patent
LanguageEnglish
Published 22.07.2021
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to en-hance bath stability.
Bibliography:Application Number: MY2017PI701361