EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass% of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 4 7 to 75 mass% of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 ma...

Full description

Saved in:
Bibliographic Details
Main Authors YAMAZAWA, TOMOYA, OKOSHI, KODAI, ABE, NOBUYUKI, KOHARA, KAZUYUKI
Format Patent
LanguageEnglish
Published 14.06.2021
Online AccessGet full text

Cover

More Information
Summary:An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass% of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 4 7 to 75 mass% of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass% of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass% in total. Figure 2
Bibliography:Application Number: MY2016PI701410