METHOD FOR COMPRESSION-MOLDING ELECTRONIC PARTS, AND MOLD SYSTEM

In the process of supplying a granular resin (6) into a lower-die cavity (5), the reliability of the amount of resin supplied into lower-die cavity is efficiently improved by the following method: The bottom side of a resin-receiving plate (21) having an opening section (37) corresponding to the low...

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Bibliographic Details
Main Authors NAOKI, TAKADA, OTSUKI, OSAMU, URAGAMI, HIROSHI
Format Patent
LanguageEnglish
Published 05.02.2021
Online AccessGet full text

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