METHOD FOR COMPRESSION-MOLDING ELECTRONIC PARTS, AND MOLD SYSTEM

• Main Authors: NAOKI, TAKADA, OTSUKI, OSAMU, URAGAMI, HIROSHI
• Format: Patent
• Language: English
• Published: 05.02.2021

In the process of supplying a granular resin (6) into a lower-die cavity (5), the reliability of the amount of resin supplied into lower-die cavity is efficiently improved by the following method: The bottom side of a resin-receiving plate (21) having an opening section (37) corresponding to the lower-die cavity is covered with a mold release film (11) to obtain a resin-supplying plate (21a) in which the opening section functions as a resin-receiving section (22). A required amount of granular resin is supplied into the resin-receiving section and then formed into a flat layer with a uniform thickness to obtain a resin-flat-loaded plate (25). Next, the resin-flat-loaded plate is set at the position of the lower-die cavity, and the mold release film is pulled into the lower-die cavity so that the required amount of flattened granular resin is made to fall together with the mold release film and supplied into the cavity covered with the mold release film. Figure 4