METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

Provided is a metal sintered bonding body having an excellent heat cycle resistance and heat dissipation performance. The metal sintered bonding body according to the present invention bonds a substrate and a die. At least the center part and a comer part of a rectangular region in which the metal s...

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Bibliographic Details
Main Authors TAKEMASA Tetsu, UESHIMA, MINORU
Format Patent
LanguageEnglish
Published 21.12.2020
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Summary:Provided is a metal sintered bonding body having an excellent heat cycle resistance and heat dissipation performance. The metal sintered bonding body according to the present invention bonds a substrate and a die. At least the center part and a comer part of a rectangular region in which the metal sintered body faces the die has a low porosity region having a porosity lower than the average porosity of the rectangular region. The low porosity region is located in a strip-shaped region in which the center line is a diagonal of the rectangular region.
Bibliography:Application Number: MY2019PI00914