ELECTRICAL INTERCONNECT FOR AN ELECTRONIC PACKAGE

• Main Authors: YONG, Khang Choong, CHEAH, Bok Eng, BEH, Teong Keat, KONG, Jackson Chung Peng, HECK, Howard L, HALL, Stephen H, OOI, Kooi Chi
• Format: Patent
• Language: English
• Published: 06.06.2020

Some example forms relate to an electrical interconnect (10, 70) for an electronic package (30A, 30B, 90). The electrical interconnect (10, 70) includes a dielectric layer (11, 71) that includes a trench (12, 75) formed into one surface of the dielectric layer (11, 71) and a signal conductor (14, 76) that fills the trench (12, 75) and extends above the one surface of dielectric layer (11, 71). The electrical interconnect (10, 70) further includes a conductive reference layer (15, 77) mounted on an opposing side of the dielectric layer (11, 71). The conductive reference layer (15, 77) is electromagnetically coupled to the signal conductor (14, 76) when current passes through the signal conductor (14, 76).