ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

• Main Authors: FUJIMARU,KOICHI, TATSUYA,YOSHIKO, NONAKA,TOSHIHISA
• Format: Patent
• Language: English
• Published: 15.02.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROVIDED IS AN ADHESIVE COMPOSITION HAVING BOTH EXCELLENT STORABILITY AND EXCELLENT CONNECTION RELIABILITY. THE ADHESIVE COMPOSITION COMPRISES (A) A POLYIMIDE SOLUBLE IN ORGANIC SOLVENTS, (B) AN EPOXY COMPOUND, (C) PARTICLES OF A CURING ACCELERATOR, AND (D) INORGANIC PARTICLES, THE AMOUNTS OF THE ORGANIC-SOLVENT-SOLUBLE POLYIMIDE (A) AND THE CURING-ACCELERATOR PARTICLES (C) BEING I 5-90 PARTS BY WEIGHT AND 0.1-50 PARTS BY WEIGHT, RESPECTIVELY, PER 100 PARTS BY WEIGHT OF THE EPOXY COMPOUND (B), AND THE CONTENT OF THE INORGANIC PARTICLES (D) BEING 30-80 WT.% OF THE TOTAL AMOUNT OF(A) TO (D).