POLISHING COMPOSITION AND POLISHING METHOD

A polishing composition of the present invention includes alumina, colloidal silica, citric acid, an organic acid other than citric acid, an oxidizing agent, and water. When the polishing composition is used in polishing the surface of a substrate for a magnetic disk, the substrate is polished at a...

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Bibliographic Details
Main Authors JIE LIN, W. SCOTT RADER
Format Patent
LanguageEnglish
Published 30.08.2016
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Summary:A polishing composition of the present invention includes alumina, colloidal silica, citric acid, an organic acid other than citric acid, an oxidizing agent, and water. When the polishing composition is used in polishing the surface of a substrate for a magnetic disk, the substrate is polished at a high rate, and the substrate after polishing has reduced surface defects.
Bibliography:Application Number: MY2004PI05374