EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTORS WHICH COMPRISES AS ESSENTIAL COMPONENTS (A) AN EPOXY RESIN, (B) A PHENOL RESIN, (C) A CURING ACCELERATOR, (D) AN INORGANIC FILLER AND (E) A COMPONENT COMPRISING (E1) A BUTADIENE-ACRYLONITRILE COPOLYMER HAVING CARBOXYL GROUP AND/OR (E2) A RE...

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Bibliographic Details
Main Author YASUHIRO MIZUNO
Format Patent
LanguageEnglish
Published 15.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTORS WHICH COMPRISES AS ESSENTIAL COMPONENTS (A) AN EPOXY RESIN, (B) A PHENOL RESIN, (C) A CURING ACCELERATOR, (D) AN INORGANIC FILLER AND (E) A COMPONENT COMPRISING (E1) A BUTADIENE-ACRYLONITRILE COPOLYMER HAVING CARBOXYL GROUP AND/OR (E2) A REACTION PRODUCT OF (E1) A BUTADIENE-ACRYLONITRILE COPOLYMER HAVING CARBOXYL GROUP WITH AN EPOXY RESIN, WHEREIN THE CONTENT OF COMPONENT (E1) IN THE ENTIRE EPOXY RESIN COMPOSITION IS 0.01 TO 1% BY WEIGHT. THE COMPOSITION EXHIBITS EXCELLENT RELEASING PROPERTY IN MOLDING, CONTINUOUS MOLDING PROPERTY AND RESISTANCE TO SOLDER REFLOW.
Bibliography:Application Number: MY2011PI05030