POLISHING COMPOSITION FOR SILICON WAFERS

A POLISHING COMPOSITION FOR A SILICON WAFER INCLUDES A MACROMOLECULAR COMPOUND, AN ABRASIVE, AND AN AQUEOUS MEDIUM. THE MACROMOLECULAR COMPOUND INCLUDES A CONSTITUTIONAL UNIT (A1) REPRESENTED BY THE FOLLOWING GENERAL FORMULA (1), A CONSTITUTIONAL UNIT (A2) REPRESENTED BY THE FOLLOWING GENERAL FORMUL...

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Bibliographic Details
Main Authors OKAMURA,MAMI, SUZUKI,MASAHIKO, OI,TOSHIAKI
Format Patent
LanguageEnglish
Published 15.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A POLISHING COMPOSITION FOR A SILICON WAFER INCLUDES A MACROMOLECULAR COMPOUND, AN ABRASIVE, AND AN AQUEOUS MEDIUM. THE MACROMOLECULAR COMPOUND INCLUDES A CONSTITUTIONAL UNIT (A1) REPRESENTED BY THE FOLLOWING GENERAL FORMULA (1), A CONSTITUTIONAL UNIT (A2) REPRESENTED BY THE FOLLOWING GENERAL FORMULA (2), AND A CONSTITUTIONAL UNIT (A3) REPRESENTED BY THE FOLLOWING GENERAL FORMULA (3). THE TOTAL OF THE CONSTITUTIONAL UNIT (A3) IS 0.001 TO 1.5 MOL% OF ALL THE CONSTITUTIONAL UNITS OF THE MACROMOLECULAR COMPOUND. [CHEMICAL FORMULA 1]
Bibliography:Application Number: MY2012PI00031