POLISHING COMPOSITION AND METHOD FOR HIGH SILICON NITRIDE TO SILICON OXIDE REMOVAL RATE RATIOS

THE INVENTION PROVIDES A CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING A CATIONIC ABRASIVE, A CATIONIC POLYMER, A CARBOXYLIC ACID, AND WATER. THE INVENTION FURTHER PROVIDES A METHOD OF CHEMICALLY-MECHANICALLY POLISHING A SUBSTRATE WITH THE AFOREMENTIONED POLISHING COMPOSITION. THE POLISHING C...

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Bibliographic Details
Main Authors PHILLIP W. CARTER, TIMOTHY P. JOHNS
Format Patent
LanguageEnglish
Published 13.09.2013
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Summary:THE INVENTION PROVIDES A CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING A CATIONIC ABRASIVE, A CATIONIC POLYMER, A CARBOXYLIC ACID, AND WATER. THE INVENTION FURTHER PROVIDES A METHOD OF CHEMICALLY-MECHANICALLY POLISHING A SUBSTRATE WITH THE AFOREMENTIONED POLISHING COMPOSITION. THE POLISHING COMPOSITION EXHIBITS SELECTIVITY FOR REMOVAL OF SILICON NITRIDE OVER REMOVAL OF SILICON OXIDE.
Bibliography:Application Number: MY2005PI05187