CONTROLLED ELECTROCHEMICAL POLISHING METHOD
THE INVENTION RELATES TO A METHOD OF POLISHING A SUBSTRATE COMPRISING AT LEAST ONE METAL LAYER BY APPLYING AN ELECTROCHEMICAL POTENTIAL BETWEEN THE SUBSTRATE AND AT LEAST ONE ELECTRODE IN CONTACT WITH A POLISHING COMPOSITION COMPRISING A REDUCING AGENT OR AN OXIDIZING AGENT.
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
13.04.2012
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Subjects | |
Online Access | Get full text |
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Summary: | THE INVENTION RELATES TO A METHOD OF POLISHING A SUBSTRATE COMPRISING AT LEAST ONE METAL LAYER BY APPLYING AN ELECTROCHEMICAL POTENTIAL BETWEEN THE SUBSTRATE AND AT LEAST ONE ELECTRODE IN CONTACT WITH A POLISHING COMPOSITION COMPRISING A REDUCING AGENT OR AN OXIDIZING AGENT. |
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Bibliography: | Application Number: MY2006PI02746 |