POLISHING APPARATUS

THE POLISHING APPARATUS (10) IS CAPABLE OF PRECISELY CONTROLLING POLISHING PRESSURE, CORRECTLY POSITIONING A PRESS PLATE (47) AND UNIFORMLY POLISHING A WORKPIECE (W). IN THE POLISHING APPARATUS (10), A HOLDING HEAD COMPRISES: FIRST PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A FIRST FLUI...

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Bibliographic Details
Main Authors HIROMI KISHIDA, TADAKAZU MIYASHITA
Format Patent
LanguageEnglish
Published 30.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:THE POLISHING APPARATUS (10) IS CAPABLE OF PRECISELY CONTROLLING POLISHING PRESSURE, CORRECTLY POSITIONING A PRESS PLATE (47) AND UNIFORMLY POLISHING A WORKPIECE (W). IN THE POLISHING APPARATUS (10), A HOLDING HEAD COMPRISES: FIRST PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A FIRST FLUID CHAMBER (39) AND PRESSING A MAIN HEAD SECTION (24) DOWNWARD; SECOND PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A SECOND FLUID CHAMBER (50) AND PRESSING A PRESS PLATE (47) DOWNWARD; AND THIRD PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A THIRD FLUID CHAMBER (64) AND PRESSING THE WORKPIECE (W) DOWNWARD. WITH THIS STRUCTURE, THE WORKPIECE (W) IS HELD ON THE LOWER SIDE OF AN ELASTIC SHEET MEMBER (63), AND THE LOWER FACE OF THE WORKPIECE (W) CAN BE POLISHED BY A POLISHING PLATE (14).
Bibliography:Application Number: MY2005PI01439