POLISHING COMPOSITION

THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; A METHOD FOR MANUFACTURING A SUBSTRATE INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE PO...

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Bibliographic Details
Main Authors TOSHIYA HAGIHARA, SHIGEAKI TAKASHINA, YUICHI HONMA, HIROYUKI YOSHIDA
Format Patent
LanguageEnglish
Published 16.07.2010
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Summary:THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; A METHOD FOR MANUFACTURING A SUBSTRATE INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; AND A METHOD FOR REDUCING SCRATCHES ON A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, INCLUDING THE STEP OF ADJUSTING A ZETA POTENTIAL OF SILICA PARTICLES IN THE POLISHING COMPOSITION TO -15 TO 40 MV. THE POLISHING COMPOSITION CAN BE FAVORABLY USED IN POLISHING THE SUBSTRATE FOR PRECISION PARTS, INCLUDING SUBSTRATES FOR MAGNETIC RECORDING MEDIA SUCH AS MAGNETIC DISCS, OPTICAL DISCS AND OPTO-MAGNETIC DISCS; PHOTOMASK SUBSTRATES; OPTICAL LENSES; OPTICAL MIRRORS; OPTICAL PRISMS; SEMICONDUCTOR SUBSTRATES; AND THE LIKE.
Bibliography:Application Number: MY2005PI01185