MOLD CLEANING RESIN COMPOSITION

A MOLD CLEANING RESIN COMPOSITION FOR REMOVING SOILS FROM THE SURFACE OF A MOLD IN MOLDING A CURING RESING MOLDING MATERIAL, WHICH COMPRISES A MELAMINE RESIN AS A MOLD CLEANING RESIN AND A FIBROUS INORGANIC COMPOUND HAVING AN AVERAGE FIBER LENGTH OF 5 TO 30 UM, AN AVERAGE FIBER DIAMETER OF 0.1 TO 1....

Full description

Saved in:
Bibliographic Details
Main Authors HIROAKI NOMURA, KIYOHITO HIROMITSU, MITSUYOSHI SASAYAMA
Format Patent
LanguageEnglish
Published 15.01.2010
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A MOLD CLEANING RESIN COMPOSITION FOR REMOVING SOILS FROM THE SURFACE OF A MOLD IN MOLDING A CURING RESING MOLDING MATERIAL, WHICH COMPRISES A MELAMINE RESIN AS A MOLD CLEANING RESIN AND A FIBROUS INORGANIC COMPOUND HAVING AN AVERAGE FIBER LENGTH OF 5 TO 30 UM, AN AVERAGE FIBER DIAMETER OF 0.1 TO 1.0 UM , AND AN ASPECT RATIO OF 10 TO 60.
Bibliography:Application Number: MY2001PI04649