PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR

A PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR WHICH IS MADE BY PUNCHING AN ADHESIVE TAPE COMPRISING A BASE FILM AND AN ADHESIVE LAYER PROVIDED ON ONE OR EACH SIDE OF THE BASE FILM TO MARK THE REGIONS IN THE ADHESIVE TAPE WHERE CONTAMINANTS OR DEFECTS ARE CONTAINED; A METHOD OF PRODUCING AN ADHESIVE TAPE...

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Bibliographic Details
Main Authors YOSHIYUKI TANABE, YOUICHI HOSOKAWA, SHINJI IIOKA, YOSHIHIRO NOMURA, HIROSHI KIRIHARA, SATORU YANAGISAWA
Format Patent
LanguageEnglish
Published 31.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR WHICH IS MADE BY PUNCHING AN ADHESIVE TAPE COMPRISING A BASE FILM AND AN ADHESIVE LAYER PROVIDED ON ONE OR EACH SIDE OF THE BASE FILM TO MARK THE REGIONS IN THE ADHESIVE TAPE WHERE CONTAMINANTS OR DEFECTS ARE CONTAINED; A METHOD OF PRODUCING AN ADHESIVE TAPE-BEARING LEAD FRAME BY PUNCHING THE PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, WITH THE PARTS CONTAINING THE PUNCHED HOLES SKIPPED OVER, AND APPLYING THE ADHESIVE TAPE PIECES PUNCHED OUT FROM THE PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR TO A LEAD FRAME; A SEMICONDUCTOR DEVICE FABRICATED BY USING THE ADHESIVE-BEARING LEAD FRAME.(FIG 1)
Bibliography:Application Number: MY2004PI01743