SEMICONDUCTOR DEVICE HAVING A THERMOSET-CONTAINING DIELECTRIC MATERIAL AND METHODS FOR FABRICATING THE SAME

• Main Authors: KONSTANTINOS I. PAPATHOMAS, MARK D. POLIKS, DONALD S. FARQUHAR
• Format: Patent
• Language: English
• Published: 29.12.2006
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A SEMICONDUCTOR DEVICE HAVING A THERMOSET-CONTAINING, DIELECTRIC MATERIAL AND METHODS FOR FABRICATING THE SAME IS PROVIDED. THE DEVICE MAY TAKE THE FORM OF A PRINTED CIRCUIT BOARD, AN INTEGRATED CIRCUIT CHIP CARRIER, OR THE LIKE. THE DIELECTRIC MATERIAL IS A NON-FIBRILLATED, FLUOROPOLYMER MATRIX (10) THAT HAS INORGANIC PARTICLES (14) DISTRIBUTED THEREIN AND IS IMPREGNATED WITH A THERMOSET MATERIAL (12).(FIG. 1)