ELECTRODEPOSITED COPPER FOIL WITH CARRIER, METHOD FOR PRODUCING THE ELECTRODEPOSITED COPPER FOIL, AND COPPER-CLAD LAMINATE FORMED BY USE OF THE ELECTRODEPOSITED COPPER FOIL

TO CONTROL PEEL STRENGTH AT AN ORGANIC RELEASE INTERFACE BETWEEN A CARRIER FOIL AND A COPPER- MICROPARTICLE LAYER WHICH CONSTITUTE AN ELECTRODEPOSITED COPPER FOIL WITH CARRIER. IN THE PRESENT INVENTION, (1) A BARRIER COPPER LAYER IS FORMED ON THE RELEASE INTERFACE LAYER AND COPPER MICROPARTICLES ARE...

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Bibliographic Details
Main Authors MAKOTO DOBASHI, SHIN-ICHI OBATA
Format Patent
LanguageEnglish
Published 29.04.2006
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TRANSPORTING
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Summary:TO CONTROL PEEL STRENGTH AT AN ORGANIC RELEASE INTERFACE BETWEEN A CARRIER FOIL AND A COPPER- MICROPARTICLE LAYER WHICH CONSTITUTE AN ELECTRODEPOSITED COPPER FOIL WITH CARRIER. IN THE PRESENT INVENTION, (1) A BARRIER COPPER LAYER IS FORMED ON THE RELEASE INTERFACE LAYER AND COPPER MICROPARTICLES ARE FORMED ON THE BARRIER LAYER; (2) THE ANTI-CORROSION TREATMENT IS CARRIED OUT BY USE OF A PLATING BATH CONTAINING A SINGLE METALLIC COMPONENT OR A PLURALITY OF METALLIC COMPONENTS FOR FORMING AN ALLOY, THE PLATING BATH(S) HAVING A DEPOSITION POTENTIAL LESS NEGATIVE THAN -900 MV (VS. AGCL/AG REFERENCE ELECTRODE); AND (3) METHODS (1) AND (2) ARE COMBINED. (FIG. 1)
Bibliography:Application Number: MY2000PI03930