VISCOSITY MODIFIER FOR THERMOSETTING RESIN COMPOSITION

A HEAT CURABLE THERMOSETTING EPOXY RESIN FORMULATION USEFUL FOR MAKING PREPREGS AND ELECTRICAL LAMINATES CONTAINING A VISCOSITY MODIFIER, WHEREIN THE VISCOSITY MODIFIER IS; @(a) AN OPTIONALLY SUBSTITUTED POLYMER OF A MONOVINYLIDENE AROMATIC MONOMER, OPTIONALLY HAVING ONE OR MORE FURTHER UNSATURATED...

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Bibliographic Details
Main Author JOSEPH GAN
Format Patent
LanguageEnglish
Published 29.04.2006
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Summary:A HEAT CURABLE THERMOSETTING EPOXY RESIN FORMULATION USEFUL FOR MAKING PREPREGS AND ELECTRICAL LAMINATES CONTAINING A VISCOSITY MODIFIER, WHEREIN THE VISCOSITY MODIFIER IS; @(a) AN OPTIONALLY SUBSTITUTED POLYMER OF A MONOVINYLIDENE AROMATIC MONOMER, OPTIONALLY HAVING ONE OR MORE FURTHER UNSATURATED MONOMERS COPOLYMERIZED THEREWITH;@(b) AN OPTIONALLY SUBSTITUTED POLYPHENYLENE OXIDE; OR@(c) AN OXAZOLIDONE RING-CONTAINING COMPOUND.
Bibliography:Application Number: MY1999PI03489