VISCOSITY MODIFIER FOR THERMOSETTING RESIN COMPOSITION
A HEAT CURABLE THERMOSETTING EPOXY RESIN FORMULATION USEFUL FOR MAKING PREPREGS AND ELECTRICAL LAMINATES CONTAINING A VISCOSITY MODIFIER, WHEREIN THE VISCOSITY MODIFIER IS; @(a) AN OPTIONALLY SUBSTITUTED POLYMER OF A MONOVINYLIDENE AROMATIC MONOMER, OPTIONALLY HAVING ONE OR MORE FURTHER UNSATURATED...
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Main Author | |
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Format | Patent |
Language | English |
Published |
29.04.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A HEAT CURABLE THERMOSETTING EPOXY RESIN FORMULATION USEFUL FOR MAKING PREPREGS AND ELECTRICAL LAMINATES CONTAINING A VISCOSITY MODIFIER, WHEREIN THE VISCOSITY MODIFIER IS; @(a) AN OPTIONALLY SUBSTITUTED POLYMER OF A MONOVINYLIDENE AROMATIC MONOMER, OPTIONALLY HAVING ONE OR MORE FURTHER UNSATURATED MONOMERS COPOLYMERIZED THEREWITH;@(b) AN OPTIONALLY SUBSTITUTED POLYPHENYLENE OXIDE; OR@(c) AN OXAZOLIDONE RING-CONTAINING COMPOUND. |
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Bibliography: | Application Number: MY1999PI03489 |