PROCESS FOR THICKENING THERMOSET RESIN MOLDING COMPOUND COMPOSITIONS
THIS INVENTION RELATES TO A PROCESS FOR MAKING A THICKENED THERMOSET RESIN COMPOSITION, COMPRISING: MIXING(A) A CARBOXYLIC ACID CONTAINING THERMOSET RESIN COMPOSITION; AND(B) AT LEAST ONE COMPOUND REPRESENTED BY THE FORMULA WHEREIN IN FORMULA (B-1): R1, R2, R3 AND R4 ARE INDEPENDENTLY HYDROGEN OR ME...
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Main Author | |
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Format | Patent |
Language | English |
Published |
31.12.2003
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Subjects | |
Online Access | Get full text |
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Summary: | THIS INVENTION RELATES TO A PROCESS FOR MAKING A THICKENED THERMOSET RESIN COMPOSITION, COMPRISING: MIXING(A) A CARBOXYLIC ACID CONTAINING THERMOSET RESIN COMPOSITION; AND(B) AT LEAST ONE COMPOUND REPRESENTED BY THE FORMULA WHEREIN IN FORMULA (B-1): R1, R2, R3 AND R4 ARE INDEPENDENTLY HYDROGEN OR METHYL; R5 IS HYDROGEN, A HYDROCARBON GROUP OR A SUBSTITUTED HYDROCARBON GROUP, THE SUBSTITUENTS ON SAID SUBSTITUTED HYDROCARBON GROUP COMPRISING OXYGEN AND/OR NITROGEN; AND N IS AT LEAST 1. |
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Bibliography: | Application Number: MY1919PI970346 |