AQUEOUS COATING COMPOSITION FOR DIPCOATING ELECTRICALLY CONDUCTIVE SUBSTRATES CONTAINING BISMUTH AND LITHIUM

The present invention relates to aqueous coating composition (A) for at least partially coating an electrically conductive substrate with an electrocoat comprising (A1) at least one cathodically depositable resin as a binder, (A2) at least one crosslinker, (A3) at least 100 ppm of bismuth based on t...

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Main Authors MUEHLMEYER Justina, FITTKOW Nina, HEMKER Susanne, TOBOLL Petra, HOENE Andrea, BROSSEIT Andre, GELBRICH Thorsten, KEIL Patrick
Format Patent
LanguageEnglish
Spanish
Published 12.11.2021
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Summary:The present invention relates to aqueous coating composition (A) for at least partially coating an electrically conductive substrate with an electrocoat comprising (A1) at least one cathodically depositable resin as a binder, (A2) at least one crosslinker, (A3) at least 100 ppm of bismuth based on the total weight of the coating composition (A), and (A4) lithium in a form dissolved in (A), wherein this lithium does not exceed a proportion of 300 ppm based on the total weight of the coating composition (A). The present invention also relates to a process for producing (A), to a coating process and to an at least partially coated substrate obtainable by this process. La presente invención se relaciona con una composición acuosa de recubrimiento (A) para recubrir al menos parcialmente un sustrato eléctricamente conductor con un material de recubrimiento electroforético, que comprende (A1) al menos un ligante de resina catódicamente depositable, (A2) al menos un agente de reticulación, (A3) al menos 100 ppm de bismuto, sobre la base del peso total de la composición de recubrimiento (A), y (A4) litio, en una forma disuelta en (A), no excediendo dicho litio una fracción de 300 ppm, sobre la base del peso total de la composición de recubrimiento (A). La presente invención se relaciona además con un método para producir (A), con un método de recubrimiento, y con un sustrato al menos parcialmente recubierto mediante este método.
Bibliography:Application Number: MX2021012611