CONDUCTIVE MOULDING COMPOUNDS

• Main Authors: GÖRING Rainer, LINEMANN Reinhard, BAUMANN Franz- Erich, SZENTIVANYI Andreas, GAHLMANN Klaus, BÖER Michael, RESING Mario, WEISS Christine, FARGES Olivier
• Format: Patent
• Language: English; Spanish
• Published: 06.07.2021
• Subjects: ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS INVEHICLES; ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OFTRANSMISSIONS IN VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GASEXHAUST OR FUEL SUPPLY OF PROPULSION UNITS, IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; BLASTING; CHEMISTRY; COMBUSTION ENGINES; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; HEATING; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIGHTING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MECHANICAL ENGINEERING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SUPPLYING COMBUSTION ENGINES IN GENERAL, WITH COMBUSTIBLEMIXTURES OR CONSTITUENTS THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; VEHICLES IN GENERAL; WEAPONS

The present invention relates to a moulding compound which contains at least 50 wt.% of a semicrystalline polyamide component and the moulding compound contains a filler which imparts conductivity to the moulding compound, wherein the moulding compound does not have a crystallite melting point (Tm) below 50°C and the polyamide component contains components A and B, A) PA homopolymer of the type PA X.Y or PA Z, where X is a diamine radical (DA), Y is a dicarboxyl radical (DC), and Z is an alpha-omega amino acid radical; B) PA copolymer of the type PA X'.Y', where X' is a diamine radical (DA') and Y' is a dicarboxyl radical (DC'); wherein a portion of the diamine radical (DA') is replaced by a polyether having at least two amino termini or at least two hydroxy termini; wherein the proportion of polyether in the sum of components A and B is between 0.5 and 15 wt.% and wherein the proportion of filler is 2.5 to 6 wt.% based on the total mass of the polyamide component and the filler. The invention also relates to a method for producing same and using same, and to hollow profiles comprising same. La presente invención se refiere a un compuesto de moldeo que contiene al menos 50% en peso de un componente de poliamida semicristalino y el compuesto de moldeo contiene un agente de relleno que imparte conductividad al compuesto de moldeo, en donde el compuesto de moldeo no tiene un punto de fusión de cristalito (Tm) por debajo de 50°C y el componente de poliamida contiene los componentes A y B, A) homopolímero PA del tipo PA X.Y o PA Z, donde X es un radical diamina (DA), Y es un radical dicarboxilo (DC) y Z es un radical de aminoácido alfa-omega; ; B) copolímero PA del tipo PA X'.Y', donde X' es un radical diamina (DA') e Y' es un radical dicarboxilo (DC'); en donde una porción del radical diamina (DA') se reemplaza por un poliéter que tiene al menos dos extremos amino o al menos dos extremos hidroxi; en donde la proporción de poliéter en la suma de los componentes A y B está entre 0.5 y 15% en peso y en donde la proporción del agente de relleno es de 2.5 a 6% en peso con base en la masa total del componente de poliamida y el agente de relleno. La invención también se refiere a un método para producir y usar los mismos, y a perfiles huecos que comprenden los mismos.