EPOXY RESIN SYSTEMS

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylph...

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Bibliographic Details
Main Authors SEPULVEDA-CAMARENA Diana, CORLEY Larry Steven, CHUNG Jennifer W, TAYLOR Leeanne, BANSAL Amitabh, HALE Alla
Format Patent
LanguageEnglish
Spanish
Published 20.07.2020
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent. Se proporcionan composiciones y métodos para formar sistemas de resina epoxi. En una modalidad, se proporciona una composición para un sistema de resina epoxi que incluye una mezcla de resina epoxi que comprende una resina epoxi, un primer agente de curado seleccionado del grupo de un alquilfosfonato de poliarileno, un arilfosfonato de poliarileno y combinaciones de los mismos, y un segundo agente de curado.
Bibliography:Application Number: MX20200002460