METHOD AND DEVICE FOR LOCATING THE ORIGIN OF A DEFECT AFFECTING A STACK OF THIN LAYERS DEPOSITED ON A SUBSTRATE

• Main Authors: Grégoire MATHEY, Yohan FAUCILLON, Thierry KAUFFMANN, Bernard NGHIEM
• Format: Patent
• Language: English; Spanish
• Published: 30.05.2019
• Subjects: CALCULATING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPUTING; COUNTING; DIFFUSION TREATMENT OF METALLIC MATERIAL; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; METALLURGY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TESTING

This method for locating, in a deposition line comprising a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer of a material is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, comprises: a step (E10) of obtaining at least one image showing said defect, said at least one image being acquired by at least one optical inspecting system placed at the end of the deposition line; a step (E20) of determining, from said at least one image, a signature of the defect, this signature containing at least one characteristic representative of the defect; and a step (E40) of identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line. Este método de localización, en una línea de deposición comprende una sucesión de compartimientos, un origen de un defecto que afecta a una pila de capas delgadas depositadas en un sustrato en los compartimientos, en los que cada capa delgada de un material se deposita en uno o más compartimientos sucesivos de la línea de deposición y los fragmentos de desechos que permanecen en la superficie de una capa delgada depositados en un compartimiento actúan como máscaras para las posteriores deposiciones de capas delgadas y son el origen de defectos, comprende: - una etapa (E10) para obtener al menos una imagen que muestra el defecto, al menos una imagen se adquiere por al menos un sistema de inspección óptica colocado en el extremo de la línea de deposición; - una etapa (E20) para determinar, a partir de al menos una imagen, una huella del defecto, esta huella contiene al menos una característica representativa del defecto; y - una etapa (E40) para identificar al menos un compartimiento de la línea de deposición responsable de ser el origen del defecto a partir de la huella del defecto y que utiliza huellas de referencia asociadas con los compartimientos de la línea de deposición.