ADHESIVE FORMULATIONS WITH IMPROVED THERMAL AND BONDING PROPERTIES
The present invention refers to a composition comprising: (a) 5-95wt% of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30ºC and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt% of poly(alkylene car...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English Spanish |
Published |
02.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention refers to a composition comprising: (a) 5-95wt% of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30ºC and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt% of poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature higher than 30ºC. It also refers to a method for producing said composition as well as to its use for preparing adhesive formulations with improved thermal stability and adhesion properties.
La presente invención se refiere a una composición que comprende: (a) el 5-95% en peso de un poli(carbonato de alquileno), en la que dicho poli(carbonato de alquileno) tiene una temperatura de transición vítrea igual a o menor de 30ºC y un peso molecular promedio en número mayor de 15.000 Da; y (b) el 95-5% en peso de poli(carbonato de alquileno), en la que dicho poli(carbonato de alquileno) tiene una temperatura de transición vítrea mayor de 30ºC. También se refiere a un método para producir dicha composición así como a su uso para preparar formulaciones de adhesivo con propiedades de estabilidad térmica y adhesión mejoradas. |
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Bibliography: | Application Number: MX20180013730 |