PROCESS FOR TEXTURING THE SURFACE OF A SILICON SUBSTRATE, STRUCTURED SUBSTRATE AND PHOTOVOLTAIC DEVICE COMPRISING SUCH A STRUCTURED SUBSTRATE

The invention relates to a process for texturing the surface of a silicon substrate, comprising a step of exposing said surface to an MDECR plasma generated, at least from argon, using between 1.5 W/cm2 and 6.5 W/cm2 of plasma power in a matrix distributed electron cyclotron resonance plasma source,...

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Bibliographic Details
Main Authors PAVEL BULKIN, NADA HABKA, PERE ROCA I CABARROCAS
Format Patent
LanguageEnglish
Spanish
Published 09.10.2015
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Summary:The invention relates to a process for texturing the surface of a silicon substrate, comprising a step of exposing said surface to an MDECR plasma generated, at least from argon, using between 1.5 W/cm2 and 6.5 W/cm2 of plasma power in a matrix distributed electron cyclotron resonance plasma source, the substrate bias being between 100 V and 300 V. La invención se relaciona a un proceso para texturizar la superficie de un substrato de silicio, que comprende una etapa de exposición de la superficie a un plasma MDECR generado, por lo menos de argón, usando entre 1.5 W/cm2 y 6.5 W/cm2 de potencia de plasma en una fuente de plasma de resonancia ciclotrónica electrónica distribuida en matriz, la polarización del substrato que está entre 100 V y 300 V.
Bibliography:Application Number: MX20140007392