SEMICONDUCTOR DEVICE HAVING A RADIATING PART

A semiconductor device constituted by a VSMP (Vertical Surface Mount Package) is provided in which a thickness of a plastic package encapsulating a semiconductor chip is very small, wherein even when a semiconductor chip having large power consumption is contained therein, the effect of heat radiati...

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Bibliographic Details
Main Author HARA, KOUJI
Format Patent
LanguageEnglish
Korean
Published 29.04.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device constituted by a VSMP (Vertical Surface Mount Package) is provided in which a thickness of a plastic package encapsulating a semiconductor chip is very small, wherein even when a semiconductor chip having large power consumption is contained therein, the effect of heat radiation can be effectively improved. A VSMP constituting the semiconductor device, which is mounted perpendicularly on a surface of a substrate, includes: external connection terminals for supplying I/O signals from peripheral circuits and electric power to the semiconductor chip; supporting terminals for holding the VSMP in a perpendicularly-mounted state; a plastic package for protecting the internal elements; and radiating fins with an irregular configuration provided on both sides of the plastic package. The radiating fins having the irregular configuration are formed so as to extend in a direction of a length of the semiconductor device and are formed on both the front side and the rear side of the plastic package.
Bibliography:Application Number: KR19930016343