MOUNTING METHOD OF ELECTRONIC COMPONENTS ON SUBSTRATES

• Main Author: PONN, TIMOTHY R
• Format: Patent
• Language: English; Korean
• Published: 24.03.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

요약 없음. A method for mounting electronic components, such as capacitor, to a flat flexible insulating substrate (16) having conductive material thereon. In one form of the invention, an electronic component (14) is attached to a given area of the substrate with one conductive side (14b) of the electronic component in electrical connection with the conductive material on the substrate. A slot (20) is formed in the substrate substantially about the electronic component but less than 360 DEG thereabout to define a tongue (22a), including the electronic component, and an integral hinge portion (24) of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360 DEG slot (56) is formed in the substrate (50). One conductive (46) side of the electronic component (14) is in electrical connection with the conductive material on the substrate (58) within the closed slot, and the other conductive side (14) of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal (62) is electrically connected to the conductive material on the substrate inside the closed slot.