MULTIPURPOSE SOCKET
요약없음 A test socket for testing chips and chips on tape wherein the test socket is formed on a heat resistant dielectric film having contact pads and connector pads joined by metallic circuit traces and which film is wrapped on a compliant pad. The connector end of the tape is joined to a circuit boa...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
18.03.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | 요약없음
A test socket for testing chips and chips on tape wherein the test socket is formed on a heat resistant dielectric film having contact pads and connector pads joined by metallic circuit traces and which film is wrapped on a compliant pad. The connector end of the tape is joined to a circuit board by a conductive tape and maintained in contact by the compliant pad. A frame registers the chip with the contact area of the tape. |
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Bibliography: | Application Number: KR19880012346 |