CONDUCTIVE POLYSULFONE RESIN COMPOSITIONS

• Main Authors: YOSHIMURA, MASAJI, SATO, TAKASHI, UEKI, TORU, KISHI, SUSUMU
• Format: Patent
• Language: English; Korean
• Published: 17.02.1995
• Edition: 6
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; HANDLING THIN OR FILAMENTARY MATERIAL; INSULATORS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

A conductive polysulfone resin composition which has excellent processability and is prepared by mixing (A) 100 parts by weight of a composition essentially consisting of from 5 to 95% by weight of an aromatic polysulfone resin and from 95 to 5% by weight of a polyphenylene sulfide resin with (B) from 3 to 40 parts by weight of conductive carbon, is provided by the present invention; and molded articles having excellent electrical conductivity, heat resistance and mechanical strength, for example, a high-heat-resistant, conductive semi-conductor-chip-carrier can be prepared from the composition by injection molding and other processing methods.