EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PARTS

The epoxy resin compsn. for sealing a semiconductor device is composed of 10-20 wt.% of an ortho-cresol novolak epoxy resin, 5-10 wt.% of a phenol novolak resin as a curing agent, 65-80 wt.% of a high purity crystalline or molten silica as an inorganic filler, 0.1-0.5 wt.% of a curing accelator (A),...

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Bibliographic Details
Main Authors KIM, SONG - KYUN, U, HUI - U, PARK, YUN - KOK
Format Patent
LanguageEnglish
Korean
Published 12.01.1995
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The epoxy resin compsn. for sealing a semiconductor device is composed of 10-20 wt.% of an ortho-cresol novolak epoxy resin, 5-10 wt.% of a phenol novolak resin as a curing agent, 65-80 wt.% of a high purity crystalline or molten silica as an inorganic filler, 0.1-0.5 wt.% of a curing accelator (A), 0.2-0.8 wt.% of a curing accelator (B), 0.2-1.0 wt.% of a silane coupling agent, 0.2-0.8 wt.% of a releasing agent, 0.1-0.5 wt.% of a carbon black as a colourant, 1.0-3.0 wt.% of a brominated epoxy resin as an organic flame retardant, and 0.5-3.0 wt.% of an antimony trioxide as an inorganic flame retardant. The epoxy resin compsn. for sealing the semiconductor device has a good heat conductivity and a high heat resistance.
Bibliography:Application Number: KR19910003794