MULTI PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and me...

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Main Authors KITAMURA, NAOYA, SHOJI, FUSAJI, KYOI, MOSAYUKI, MATSUYAMA, HARUHIKO, OKA, HITOSHI, KATAOKA, FUMIO, MUROOKA, HIDEYASU, INOUE, TAKASHI, ARIMA, HIDEO, YOKONO, HITOSHI
Format Patent
LanguageEnglish
Korean
Published 14.10.1993
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.
Bibliography:Application Number: KR19910004319