RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PARTS

• Main Authors: SAKAKUCHI, YASUO, ENOKI, TOSHIO, KOYAMA, TOSHITAKA, SUZUKI, KEIICHIRO
• Format: Patent
• Language: English; Korean
• Published: 08.05.1993
• Edition: 5
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt.% of a poly(arylene thioether-ketone) and 0-90 wt.% of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.