RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PARTS

Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt.% of a poly(arylene thioether-ketone) and 0-90 wt.% of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by...

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Bibliographic Details
Main Authors SAKAKUCHI, YASUO, ENOKI, TOSHIO, KOYAMA, TOSHITAKA, SUZUKI, KEIICHIRO
Format Patent
LanguageEnglish
Korean
Published 08.05.1993
Edition5
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt.% of a poly(arylene thioether-ketone) and 0-90 wt.% of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.
Bibliography:Application Number: KR19890016213