SUBASSEMBLY OF FIBER ELECTRONIC

• Main Authors: JOHNSON, BERTRAND H, BLONDER, GREG E
• Format: Patent
• Language: English; Korean
• Published: 09.05.1992
• Edition: 5
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which...