SUBASSEMBLY OF FIBER ELECTRONIC
A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English Korean |
Published |
09.05.1992
|
Edition | 5 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber (20). |
---|---|
Bibliography: | Application Number: KR19890002368 |